Industry Overview
The automotive PCB demand share has increased from 12% in 2020 to 20% in 2025, with market size exceeding $30 billion. Tesla’s Model Y adopts 24-layer high thermal conductivity PCBs with 50% improved temperature resistance; BYD achieves 12% cost reduction through vertical integration of copper foil-copper clad laminate-PCB full industry chain.
In recent years, with the rapid adoption of cutting-edge technologies like 5G communications, artificial intelligence (AI), cloud computing and big data, electronic systems are evolving towards high-speed, high-frequency, high-density, multifunctional and high-reliability directions. This has driven significant demand growth for high-end products including high-frequency/high-speed copper clad laminates, HDI (high-density interconnect) substrates and IC carrier boards. In 2024, China’s PCB copper clad laminate industry reached approximately ¥80.3 billion in market size, showing steady growth.
Market Transformation: From “Electronic Foundation” to “Intelligent Core”
In 2025, the global PCB industry is undergoing qualitative transformation from “basic support” to “technology empowerment”. According to reports, the global PCB market is projected to reach $96.8 billion (¥688 billion) with 5.8% CAGR. China remains the largest production base with ¥433.321 billion ($60 billion) market size, capturing over 50% global share. This growth is driven by three key engines:
1. AI Computing Power Surge
AI servers require $500 PCB value per unit, pushing global market beyond $12 billion
Leading Chinese manufacturers achieve over 30% market share in AI server sector with 35-40% gross margins
2. New Energy Vehicle Acceleration
Automotive PCB share grows from 12% (2020) to 20% (2025)
Tesla’s thermal management innovations and BYD’s vertical integration strategies set new benchmarks
3. 6G Technology Development
6G communications drive demand for high-frequency PCBs
Domestic alternatives for advanced materials reduce costs by 30%
Regional Development Patterns
China has formed three major industrial clusters while central/western regions emerge as new manufacturing hubs through capacity transfer. For instance, new smart factories with ¥5 billion investments focus on high-layer count and HDI boards, driving over 20% regional growth.
Market Expansion: From “Billions” to “Trillions”
China’s PCB market reaches ¥433.321 billion in 2025, representing 63% growth from 2023, significantly outpacing global averages. Key growth drivers include:
1. Policy Support
National initiatives target 40% high-end PCB production by 2025
Significant R&D funding for advanced packaging technologies
2. Technological Breakthroughs
HDI any-layer interconnect technology improves efficiency
Ultra-thin 0.3mm HDI boards achieve 95% yield for foldable phones
3. Demand Structure Evolution
Automotive electronics grow to 22% share
AI servers triple PCB value per unit
Consumer electronics shift toward flexible PCBs
Future Outlook
1. Technology Localization
Advanced packaging solutions for Chiplet integration
Domestic EUV photoresist breakthroughs for 5nm nodes
2. Material Innovation
New hydrocarbon substrates for 5G mmWave
Ultra-thin flexible materials for foldable devices
3. Cross-Industry Integration
Home appliance-PCB solutions
Complete NEV electronic system localization
With major national projects and emerging applications, the industry is poised for trillion-scale market expansion by 2030, becoming crucial for global electronics advancement.